高分辨率3D红外焦平面基础技术研究

项目名称： 高分辨率3D红外焦平面基础技术研究

项目编号： No.61306064

项目类型： 青年科学基金项目

立项/批准年度： 2014

项目学科： 无线电电子学、电信技术

项目作者： 黄张成

作者单位： 中国科学院上海技术物理研究所

项目金额： 27万元

中文摘要： 我国新一代航天遥感要求高空间分辨率，缩小焦平面像元中心距成为亟待解决的问题。当像元间距发展到10微米及以下时，基于常规集成电路工艺的读出电路不能满足高性能红外焦平面的需求。新兴的3D-IC工艺，通过多层电路垂直互连,突破了像元面积的限制，为集成更多的信号处理功能提供了设计空间。本课题提出一种基于3D读出电路研制高分辨率3D红外焦平面的新思路，研究基于面积优化和信噪比优化的3D读出电路的设计方法，探索3D读出电路的模块共享技术，研究小像元尺寸InGaAs光敏芯片和3D读出电路的耦合机理，建立3D红外焦平面的信号传输和噪声的理论模型，研制10微米3D InGaAs面阵焦平面原型器件，为我国高空间分辨率红外焦平面探索新的发展技术路线。

中文关键词： 高空间分辨率；小像元；读出电路；3D-IC；耦合接口

英文摘要： With the current move towards very high resolution for space remote sensing application, decreasing the pixel pitch of infrared focal plane array (FPA) has become the bottle-neck especially when developing technology for sub-10um pixel arrays. With the rapid development of three dimensional integrated circuit (3D-IC) technology whereby multiple wafers can be stacked and vertical interconnected, the effective pixel area available is multiplely increased. The main focus of this research is the study of 3D readout integrated circuit (ROIC) and 3D focal plane array as a key technology to solve the crisis in designing sub-10um pixel for high resolution FPA. Problems which are to be studied include tradeoff method of small-pixel and low-noise 3D-ROIC design, exploration of new sharing module in 3D-structure, and interface mechanism of InGaAs detector arrays and 3D-ROIC. Finally, a prototype of 10um pixel pitch InGaAs 3D focal plane array will be developed. The prospective project is expected to enrich the theory of development of sub-10um pixel 3D InGaAs infrared focal plane arrays for high resolution imaging.

英文关键词： High resolution；smaill-pitch pixel；readout integrated circuit；3D-IC；interface