基于TSV的3D芯片“绑定中测试”关键问题研究

项目名称： 基于TSV的3D芯片“绑定中测试”关键问题研究

项目编号： No.61474035

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 无线电电子学、电信技术

项目作者： 王伟

作者单位： 合肥工业大学

项目金额： 74万元

中文摘要： 3D芯片一般采用多个2D裸片通过TSV互连的方式堆叠而成，已经成为国内外的研究热点。在堆叠绑定过程中，大量研究集中于绑定前测试和绑定后测试，较少涉及绑定中测试，这大大影响了3D芯片产业链的完整性。绑定中测试是3D芯片测试区别于2D芯片测试的关键之一，迫切需要进行针对性研究。 本项目抓住3D芯片测试区别于2D芯片的核心问题，围绕成本问题展开，研究内容包括：（1）适应多层堆叠过程的TSV模块化自测试结构，减少复杂的控制结构，提高可靠性，便于标准单元化生产；（2）测试故障覆盖率控制下的单次绑定中测试的测试调度技术, 缩短单次绑定后测试的测试时间，避免热斑；（3）适应测试调度的3D芯片选择性堆叠策略,使绑定中测试的测试总时长最小，减少测试成本。 本项目拟为3D芯片绑定中测试技术的完善和尽早走入实际应用奠定坚实的理论和技术基础，，具有重要的研究价值与实际意义。

中文关键词： 三维芯片；绑定中测试；测试调度；测试成本；硅通孔

英文摘要： Currently, 3D chip is stacked by many 2D dies in the way of TSV linking，which is a popular research subject around the world. However, the majority of researches are focused on the Pre-Bond Test and Post-Bond Test, rarely on the Mid-Bond Test, which affect the process of 3D chip's design and manufacturing. The Mid-bond Test is a key to distinguish the 3D chip-test and 2D chip-test. So, we need a further study of the Mid-Bond Test. This program starts from the key problems, the differences between the test of 3D IC and the test of 2D IC, and develops the research with many related key issues about the cost and the yield, including: (1) The project needs to adapt to the TSV self-tested module with multilayer stack process. It is good for improving the reliability and realizing standard unitized production; (2)Test scheduling for One-pass Mind-Bond Test based on fault coverage adjusting. It would reduce the test time of One-pass Mind-Bond Test and avoid Hot Spot; (3)The selective stacking strategy of monolayer die to adapt to the test scheduling. It could reduce the total test time of Mind-Bond Test and also the test cost. Above all, with clear guidance and goal, the research put a firm theoretical and technological foundation for the improvement of 3D chip's Mid-Bond Test and its application in the real world. It has important research value and owns practical value to enrich the technology of design and manufacturing and to perfect industry chains.

英文关键词： Three-Dimensional Chip;Mid-bond Test;Test Scheduling;Test Cost;TSV