三维片上网络通信自适应容错方法研究

项目名称： 三维片上网络通信自适应容错方法研究

项目编号： No.61474036

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 无线电电子学、电信技术

项目作者： 欧阳一鸣

作者单位： 合肥工业大学

项目金额： 77万元

中文摘要： 三维片上网络通过硅通孔（TSV）将多层芯片进行堆叠，具有集成密度大，通信效率高等特点，是片上多核及众核系统的主流通信架构。然而工艺偏差及物理缺陷所引发的错误和TSV良率较低等因素，使得三维片上网络面临严重的故障问题。为保证通信效率，对三维片上网络进行容错设计必不可少。本课题拟以三维片上网络通信的三个基本阶段为主线，研究能够根据故障状态动态选择最优容错策略的自适应容错方法。首先，研究基于FIFO故障粒度划分的自适应容错方法，突破传统粗放式FIFO容错的局限；其次，设计针对关键部件冗余加固的高可靠交叉开关，在故障状态下保证芯片正常通信；再次，探究能够感知TSV故障的自适应容错路由算法，在TSV出现严重故障时，使芯片通信性能损失降到最小；最后，研究基于自适应TSV控制器的高效容错策略，屏蔽TSV故障。通过本课题的研究，建立系统的自适应容错体系，为提升三维集成电路的可靠性提供理论方法和关键技术。

中文关键词： 集成电路；三维片上网络；硅通孔；自适应容错；故障测试

英文摘要： 3D NoC stacking the multi-chips with TSV has many advantages, such as high integration density and high communication efficiency. It is the mainstream of communication architecture on multi-core and many-core systems. However, due to the process variation, physical defects and low yield of TSV, 3D NoC is facing serious problems. It is essential to design a fault-tolerant mechanism for 3D NoC to ensure the efficiency of communication. Our project will explore an adaptive method to select an optimal fault-tolerant strategy, which is based on the three basic phases of 3D NoC communication. Firstly, we research an adaptive fault-tolerant mechanism based on granular partition to overcome the limitation of traditional extensive fault-tolerant based on FIFO fault granularity partition. Secondly, we design a highly reliable crossbar through the redundancy of key component to ensure normally communication under fault conditions. Thirdly, we explore an adaptive fault-aware routing algorithm to minimize the degradation of chip performance in the event of a TSV failure. Lastly, to mask the fault TSV, we explore a high-efficiency fault-tolerant strategy using the adaptive TSV controller. By researching the adaptive fault-tolerant architecture of 3D NoC, our project will provide theoretical method and key technology for the reliability of 3D ICs.

英文关键词： Integrated Circuit;3D NoC;Through-Silicon-Via;Adaptive Fault-tolerant;Fault Test