集成式多芯片LED封装光源强化出光结构设计与制造基础研究

项目名称： 集成式多芯片LED封装光源强化出光结构设计与制造基础研究

项目编号： No.U1401249

项目类型： 联合基金项目

立项/批准年度： 2015

项目学科： 管理科学

项目作者： 林立伟

作者单位： 华南理工大学

项目金额： 241万元

中文摘要： 课题从集成式LED封装光源出光强化结构设计方法与制造技术两方面切入，围绕集成式封装光源芯片、基板、一次光学透镜等多个层级，从光源内部光线传播机理出发，展开系统研究。建立光源宏观、微观、随机行为、宏微统一光学设计理论，提出集成封装光源出光强化主动功能设计方法；研究芯片级出光强化结构及其成形方法，通过超精密高速磨削与复合超声精密磨削制备特殊形状芯片结构，提高芯片一次出光效率；研究封装级出光强化结构及其成形方法，通过机械辊压制备多层复合图形化封装基板，通过纳米电镀制备具有随机散射特性的陶瓷封装基板，增大集成封装内全反射光线二次出射概率，最后通过在光源表面制备微透镜阵列，使光源综合出光效率达到最大化。通过本项目的开展逐步形成集高效光功能结构主动设计、加工与表征为一体的基础理论和技术创新，建立完整的技术储备，为我国在LED领域新的发展方向提供前沿的技术支撑。

中文关键词： 精密切削；光功能微结构；发光二极管

英文摘要： This research project is focused on the design method and manufacturing technology of light extraction enhancement structures for integrated multi-chip light-emitting diode （LED） devices, including the LED chip, lead frame substrate and primary optical lens, with the fundamental research on the mechanism analysis of light extraction enhancement. The optical design theory of the lightings macroscopic, microcosmic, random behaviors and the unity of macroscopic and microcosmic is established. The active functional design method of light extraction improvement for integrated multi-chip light-emitting diode （LED）is proposed. The project studies the design and manufacturing methods of light extraction enhancement structures in chip scale level, fabrication of particular shape chip structures to improve primary optical efficiency through ultra-precision high-speed grinding and ultrasonic- composite precision grinding technology. The project studies the design and manufacturing methods of light extraction enhancement structures in packaging level light emitting diode(LED) to increase the possibility of totally internally reflected rays re-injection. Multi-layer composite patterned lead frame substrate is prepared by rolling process, fabrication of ceramic substrate has optical random scattering properties through nano-electroplating technology. Finally in order to further improve the LED light extraction efficiency and its diffusion characteristics, a layer of micro-nano-scale optical functional structure is fabricated on the lighting surface. Overall objective of the project is to gradually establish the fundamental theory and technical innovation gathering active design, manufacturing method and representation as a whole, and to build up the complete technological reserve, which will provide cutting-edge technical support for the new LED developing direction.

英文关键词： NULL