CCF推荐会议 | 国际会议信息6条

软件工程

ISPASS 2019

International Symposium on Performance Analysis of Systems and Software

摘要截稿: 2018-09-28

全文截稿: 2018-10-06

开会时间: 2019-03-24

会议难度: ★★★

CCF分类: C类

会议地点: Madison, Wisconsin, USA

网址：http://www.ispass.org/ispass2019/

The IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS) provides a forum for sharing advanced academic and industrial research work focused on performance analysis in the design of computer systems and software. ISPASS 2019 will be held March 24 through 26, 2019 in Madison, Wisconsin (USA). Authors are invited to submit previously unpublished work for possible presentation at the conference.

图形学与多媒体

DCC 2019

Data Compression Conference

全文截稿: 2018-11-01

开会时间: 2019-03-26

会议难度: ★★★★

CCF分类: B类

会议地点: Snowbird, Utah, USA

网址：http://www.cs.brandeis.edu/~dcc/index.html

The Data Compression Conference (DCC) is an international forum for current work on data compression and related applications.

Compression of specific types of data (text, images, video, etc.).
Compression in networking, communications, and storage.
Applications to bioinformatics.
Applications to mobile computing.
Applications to information retrieval.
Computational issues for compression related applications.
Inpainting-based compression, perceptual coding.
Compressed data structures.
Quantization theory, and vector quantization (VQ).
Joint source-channel coding.
Compression related standards.
Both theoretical and experimental work are of interest.

计算机体系结构,并行与分布式计算

CGO - SRC 2019

CGO-Student Research Competition (SRC)

全文截稿: 2018-12-01

开会时间: 2019-02-16

会议难度: ★★★★★

CCF分类: B类

会议地点: Washington DC, USA

网址：http://cgo.org/cgo2019/src/

IEEE/ACM International Symposium on Code Generation and Optimization Call for Student Research Competition (SRC)

The ACM Student Research Competition (SRC) offers a unique forum for undergraduate and graduate students to present their original research before a panel of judges and attendees at CGO. Participants must be undergraduates or graduate students pursuing an academic degree at the time of initial submission. Participants must be current student members of the ACM. The abstracts will be examined by a selection committee and selected abstracts will be invited to present as posters at the conference. SRC poster submissions are, in addition, evaluated by a jury during the poster session at the conference. The best three posters are then invited to give a short presentation (10 minutes + 5 minutes questions) on the next day. Based on the submitted abstract, the poster, and the presentation, the winner of CGO's Student Research Competition will be selected, who will receive an award. In addition the winner will be invited to participate in the grand 2019 ACM SRC competition. Further information on the ACM SRC is available at: src.acm.org.

图形学与多媒体

GMP 2019

Geometric Modeling and Processing

全文截稿: 2018-12-19

开会时间: 2019-06-19

会议难度: ★★★

CCF分类: C类

会议地点: Vancouver, Canada

网址：https://gmpconf.github.io/GMP2019/index.html

Geometric Modeling and Processing (GMP) 2019 will be co-located in Vancouver with the Symposium on Solid and Physical Modeling (SPM), the SIAM conference on Computational Geometric Design, and Shape Modeling International (SMI) as part of the International Geometry Summit in 2019.

GMP is an annual international conference series on geometric modeling, simulation, and computing. The modeling and processing of geometric data is fundamental to many computer applications, including computer graphics, computer vision, CAD/CAM, medical imaging, engineering analysis, robotics, additive manufacturing, and scientific computing. The GMP conference series provides researchers and practitioners with a forum for exchanging new ideas, discussing new applications, and presenting new solutions. The organizers of GMP 2019 invite submissions of full-length papers on topics including, but not limited, to:  

Mathematical foundations of computer-aided geometric design
Computational geometry algorithms and analyses
Multi-resolution and heterogeneous modeling
3D printing and computational manufacturing
Geometric feature modeling and recognition
Representation of curves and surfaces
Discrete differential geometry
Isogeometric analysis
Shape optimization
Material modeling

数据库管理与信息检索

SIGIR 2019

International ACM SIGIR Conference on Research and Development in Information Retrieval

全文截稿: 2019-01-15

开会时间: 2019-07-21

会议难度: ★★★★★

CCF分类: A类

会议地点: Paris, France

网址：http://sigir.org/sigir2019/index.html?menu=homepage

The 42nd International ACM SIGIR Conference on Research and Development in Information Retrieval will take place on July 21-25, 2019 in Paris. The conference is backed up by the French Association for Information Retrieval and Applications (ARIA) which organizes the yearly IR French CORIA conference.

SIGIR is the premier international forum for the presentation of new research results and for the demonstration of new systems and techniques in information retrieval. The conference consists of five days of full papers, short papers, demonstrations, tutorials and workshops focused on research and development in the area of information retrieval, as well as an industry track and social events.

软件工程

COMPSAC 2019

IEEE International Conference on Computers, Software & Applications

全文截稿: 2019-01-21

开会时间: 2019-07-15

会议难度: ★★★

CCF分类: C类

会议地点: Milwaukee, Wisconsin, USA

网址：https://ieeecompsac.computer.org/2019/

COMPSAC is the IEEE Computer Society Signature Conference on Computers, Software and Applications. It is a major international forum for academia, industry, and government to discuss research results and advancements, emerging challenges, and future trends in computer and software technologies and applications. The theme of COMPSAC 2019 is Data-Driven Intelligence for a Smarter World.

In the era of “big data” there is an unprecedented increase in the amount of data collected in data warehouses. Extracting meaning and knowledge from these data is crucial for governments and businesses to support their strategic and tactical decision making. Furthermore, artificial intelligence (AI) and machine learning (ML) makes it possible for machines, processing large amounts of such data, to learn and execute tasks never before accomplished. Advances in big data-related technologies are increasing rapidly. For example, virtual assistants, smart cars, and smart home devices in the emerging Internet of Things world, can, we think, make our lives easier. But despite perceived benefits of these technologies/methodologies, there are many challenges ahead. What will be the social, cultural, and economic challenges arising from these developments?  What are the technical issue related, for example, to the privacy and security of data used by AI/ML systems? How might humans interact with, rely on, or even trust AI predictions or decisions emanating from these technologies? How can we prevent such data-driven intelligence from being used to make malicious decisions?

COMPSAC 2019, organized as a tightly integrated union of symposia, will focus on technical aspects related these kinds of issues as part of the ”Intelligence” theme of the conference.  The technical program will include keynote addresses, research papers, industrial case studies, fast abstracts, a doctoral symposium, poster sessions, and workshops and tutorials on emerging and important topics related to the conference theme.

Highlights of the conference will include plenary and specialized panels that will address the technical challenges facing technologists who are developing and deploying these data-driven intelligent systems and applications.  Panels will also address cultural and societal challenges for a society whose members must continue to learn to live, work, and play in the environments the technologies produce.

Authors are invited to submit original, unpublished research work, as well as industrial practice reports. Simultaneous submission to other publication venues is not permitted.  All submissions must adhere to IEEE Publishing Policies, and all will be vetted through the IEEE CrossCheck portal.

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