微波结合常规烧结Y-TZP、ZTA陶瓷的介电性能随温度变化的实测与模拟研究

项目名称： 微波结合常规烧结Y-TZP、ZTA陶瓷的介电性能随温度变化的实测与模拟研究

项目编号： No.51272111

项目类型： 面上项目

立项/批准年度： 2013

项目学科： 一般工业技术

项目作者： 陈利祥

作者单位： 青岛大学

项目金额： 85万元

中文摘要： 本项目提出开展微波结合常规烧结Y-TZP、ZTA陶瓷的介电性能随温度变化规律研究，将前期采用三维电磁仿真技术对Y-TZP、ZTA陶瓷在微波烧结腔内电磁场分布研究的结果以及相应的边界条件应用于温度场仿真软件Ephysics，以此来模拟研究试样的ε、tgδ在微波烧结过程中随温度场的变化状况。采用微波反射比实测技术测定试样的介电性能随烧结温度的变化值，将实测数据与模拟数据进行对比，分析其差异及影响因素，找到Y-TZP、ZTA试样在烧结过程中存在介电损耗急剧增加的临界温度。将试样在微波结合常规烧结设备中进行实际烧结，用红外测温和热成像技术监测试样的温度和尺寸变化，在临界温度时进行烧结方式的转换。用电镜和X射线衍射等仪器对烧成试样进行分析，探讨试样的不同烧结温度和几何尺寸等因素对介电性能的影响，得出ε、tgδ随温度变化的函数关系，建立与此相关的数据库，为有效实施微波结合常规烧结技术提供理论支撑。

中文关键词： 微波结合常规烧结技术；介电性能；晶粒均匀性；临界温度；温度场模拟

英文摘要： This project is proposed to carry out the actual measurement and analog simulation study on the variation of dielectric property with temperature for Y-TZP and ZTA ceramics sintered with microwave-conventional combination method. The initial simulation results about the electromagnetic field distribution of ceramics placed in the microwave cavity as well as the boundary conditions will be used in temperature field simulation software 'Ephysics' ,with which to simulate the change of ε,tgδwith temperature of the sample when using microwave sintering. The actual measurement technique named microwave reflection ratio will be used to measure the change of dielectric values with temperature of samples. Actual measured value and simulated value will be compared to analyze the difference and effect factors, meanwhile, the 'Critical temperature' for sharp increases in dielectric property will be found out during the sintering process of Y-TZP and ZTA ceramics. The microwave-conventional sintering of sample will be conducted, during the sintering process, infrared temperature measurement and thermal imaging technology will be used to monitor the variation of temperature, shape and the dimension, the sintering mode will be changed at critical temperature. Electronic microscope and XRD will be used to analyze the microstruc

英文关键词： microwave-conventional combination sintering；dielectric property；grain uniformity；critical temperature；analog simulation of temperature field